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Wafer Carrier Thickness Measuring System
Wafer Carrier Thickness Measuring System
Accurate measuring machine for carrier thickness of Wafer Lapping Machine
Specification
- Target Item : Wafer Carrier 300mm
- Size : Ø470m x Ø600, Thickness 760~780㎛
- Applied Sensor : Chromatic Confocal Sensor
- Repeatability : 0.25 ㎛
- Accurate : ±0.5㎛
- Size : Ø470m x Ø600, Thickness 760~780㎛
- Applied Sensor : Chromatic Confocal Sensor
- Repeatability : 0.25 ㎛
- Accurate : ±0.5㎛
Machine Features
- Measure the thickness at different locations as you rotate the product
- Application of Product Traverse Special Concept to Measure Various Locations
- Averaging after measuring the line thickness to reduce the measurement error
- Applied Total 7axies Motion
- Option of Auto Loading/Unloading, Dryer etc
- Application of Product Traverse Special Concept to Measure Various Locations
- Averaging after measuring the line thickness to reduce the measurement error
- Applied Total 7axies Motion
- Option of Auto Loading/Unloading, Dryer etc
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